JPH0123779Y2 - - Google Patents
Info
- Publication number
- JPH0123779Y2 JPH0123779Y2 JP16598780U JP16598780U JPH0123779Y2 JP H0123779 Y2 JPH0123779 Y2 JP H0123779Y2 JP 16598780 U JP16598780 U JP 16598780U JP 16598780 U JP16598780 U JP 16598780U JP H0123779 Y2 JPH0123779 Y2 JP H0123779Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- chip
- hole
- insulating substrate
- sealing device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 49
- 229920005989 resin Polymers 0.000 claims description 49
- 238000007789 sealing Methods 0.000 claims description 26
- 239000007788 liquid Substances 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 13
- 238000001125 extrusion Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16598780U JPH0123779Y2 (en]) | 1980-11-19 | 1980-11-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16598780U JPH0123779Y2 (en]) | 1980-11-19 | 1980-11-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5788519U JPS5788519U (en]) | 1982-06-01 |
| JPH0123779Y2 true JPH0123779Y2 (en]) | 1989-07-20 |
Family
ID=29524655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16598780U Expired JPH0123779Y2 (en]) | 1980-11-19 | 1980-11-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0123779Y2 (en]) |
-
1980
- 1980-11-19 JP JP16598780U patent/JPH0123779Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5788519U (en]) | 1982-06-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH1065055A (ja) | ボール・グリッド・アレイを形成する方法 | |
| JP3631922B2 (ja) | センタパッド型半導体パッケージ素子の製造方法 | |
| JPH0123779Y2 (en]) | ||
| JPH01268137A (ja) | 回路素子表面封じ方法及び装置 | |
| JPH05315490A (ja) | 半導体素子 | |
| DE10122942A1 (de) | Elektrodenformungsverfahren und dafür benutzte Basis zur Formung von Bump-Elektroden | |
| JPS608426Y2 (ja) | 半導体ウエハ−の保持基板 | |
| JPH06168982A (ja) | フリップチップ実装構造 | |
| JPH08213413A (ja) | シリコン素子のはんだ付け方法 | |
| JPS63289824A (ja) | 集積回路装置の実装方法 | |
| JPS60240142A (ja) | ハンダバンプ形成方法 | |
| KR100459602B1 (ko) | 범프본더 | |
| JP3481025B2 (ja) | ペレットボンディング装置 | |
| JPH022546Y2 (en]) | ||
| JPH04302457A (ja) | 混成集積回路基板の製造方法 | |
| JP2001044231A (ja) | はんだバンプ形成方法、配線基板、半導体素子、半導体パッケージ、およびそれらの製造方法 | |
| JPH07176534A (ja) | バンプ並びにその製造方法及び製造装置 | |
| JPS5728336A (en) | Forming method for electrode of semiconductor device | |
| JP2002290024A (ja) | フラックス塗布方法及びフラックス塗布装置 | |
| JPS58220434A (ja) | 半導体装置 | |
| JP2005013841A (ja) | 塗布装置および塗布方法 | |
| JP2001237534A (ja) | 電子部品実装方法及び電子部品実装用基板 | |
| JP2001250845A (ja) | 半導体チップ実装方法及び実装装置 | |
| JPS6119107B2 (en]) | ||
| JPH063833B2 (ja) | 自動フイン付け装置 |